A 3Gbps Non-Contact Inter-Module Link with Twofold Transmission Line Couplers and Low Frequency Compensation Equalizer (Special Issue : Solid State Devices and Materials)
スポンサーリンク
概要
- 論文の詳細を見る
- 2013-04-00
著者
-
Kuroda Tadahiro
Department of Electrical and Electronic Engineering Keio University
-
Kosuge Atsutake
Department of Electronics and Electrical Engineering, Keio University, Yokohama 223-8521, Japan
-
Takeya Tsutomu
Department of Electronics and Electrical Engineering, Keio University, Yokohama 223-8521, Japan
-
Shioya Mitsuru
Department of Electronics and Electrical Engineering, Keio University, Yokohama 223-8521, Japan
-
Taguchi Masao
Department of Electronics and Electrical Engineering, Keio University, Yokohama 223-8521, Japan
関連論文
- Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS (電子部品・材料)
- Chip-to-Chip Power Delivery by Inductive Coupling with Ripple Canceling Scheme
- Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS (集積回路)
- Measurement of Inductive Coupling in Wireless Superconnect
- Analysis of Inductive Coupling and Design of Rectifier Circuit for Inter-Chip Wireless Power Link
- Constant Magnetic Field Scaling in Inductive-Coupling Data Link
- Daisy Chain Transmitter for Power Reduction in Inductive-Coupling CMOS Link(Analog and Communications,Low-Power, High-Speed LSIs and Related Technologies)
- Constant Magnetic Field Scaling in Inductive-Coupling Data Link
- 60% Power Reduction in Inductive-Coupling Inter-Chip Link by Current-Sensing Technique
- A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology (Interface and Interconnect Techniques, VLSI Design Technology in the Sub-100nm Era)
- Capacitor-Shunted Transmitter for Power Reduction in Inductive-Coupling Clock Link
- Capacitor-Shunted Transmitter for Power Reduction in Inductive-Coupling Clock Link
- A 33% Improvement in Efficiency of Wireless Inter-Chip Power Delivery by Thin Film Magnetic Material for Three-Dimensional System Integration
- 6W/25mm2 Wireless Power Transmission for Non-contact Wafer-Level Testing
- Measurement of Inductive Coupling in Wireless Superconnect
- Chip-to-Chip Power Delivery by Inductive Coupling with Ripple Canceling Scheme
- A 3Gbps Non-Contact Inter-Module Link with Twofold Transmission Line Couplers and Low Frequency Compensation Equalizer (Special Issue : Solid State Devices and Materials)
- Hybrid Speaker Recognition Using Universal Acoustic Model