Kuroda Tadahiro | Department of Electrical and Electronic Engineering Keio University

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概要

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著作論文

Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS (電子部品・材料)
Chip-to-Chip Power Delivery by Inductive Coupling with Ripple Canceling Scheme
Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS (集積回路)
Measurement of Inductive Coupling in Wireless Superconnect
Analysis of Inductive Coupling and Design of Rectifier Circuit for Inter-Chip Wireless Power Link
Constant Magnetic Field Scaling in Inductive-Coupling Data Link
Daisy Chain Transmitter for Power Reduction in Inductive-Coupling CMOS Link(Analog and Communications,Low-Power, High-Speed LSIs and Related Technologies)
Constant Magnetic Field Scaling in Inductive-Coupling Data Link
60% Power Reduction in Inductive-Coupling Inter-Chip Link by Current-Sensing Technique
A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology (Interface and Interconnect Techniques, VLSI Design Technology in the Sub-100nm Era)
Capacitor-Shunted Transmitter for Power Reduction in Inductive-Coupling Clock Link
Capacitor-Shunted Transmitter for Power Reduction in Inductive-Coupling Clock Link
A 33% Improvement in Efficiency of Wireless Inter-Chip Power Delivery by Thin Film Magnetic Material for Three-Dimensional System Integration
6W/25mm2 Wireless Power Transmission for Non-contact Wafer-Level Testing
Measurement of Inductive Coupling in Wireless Superconnect
Chip-to-Chip Power Delivery by Inductive Coupling with Ripple Canceling Scheme
A 3Gbps Non-Contact Inter-Module Link with Twofold Transmission Line Couplers and Low Frequency Compensation Equalizer (Special Issue : Solid State Devices and Materials)
Hybrid Speaker Recognition Using Universal Acoustic Model

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