MIURA Noriyuki | Keio University
スポンサーリンク
概要
関連著者
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KURODA Tadahiro
Keio University, Dept. of Electronics and Electrical Engineering
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MIURA Noriyuki
Keio University
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Kuroda Tadahiro
Keio Univ.
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Kuroda Tadahiro
Department of Electrical and Electronic Engineering Keio University
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Miura Noriyuki
Keio Univ.
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Miura Noriyuki
Keio University Department Of Electronics And Electrical Engineering
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MIURA Noriyuki
the Department of Electronics and Electrical Engineering, Keio University
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MIZOGUCHI Daisuke
Keio University, Department of Electronics and Electrical Engineering
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Mizoguchi Daisuke
Keio University
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ISHIKURO Hiroki
Keio University
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Ishikuro Hiroki
Soc Research And Development Center Toshiba Corporation
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TAGO Masamoto
NEC Corporation
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SAKURAI Takayasu
The University of Tokyo
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NIITSU Kiichi
Keio University
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INOUE Mari
Keio University
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NAKAGAWA Yoshihiro
NEC Corporation
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Ishikuro Hiroki
Keio Univ. Yokohama‐shi Jpn
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Tago Masamoto
Nec Electronics Corp. Sagamihara‐shi Jpn
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Imai Shigeki
Sharp Corp. Tenri‐shi Jpn
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YAMAGISHI Nobuhiko
Department of Electronics and Electrical Engineering, Keio University
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YUAN Yuxiang
Keio University
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OCHIA Hiroyuki
Kyoto University
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Yamagishi Nobuhiko
Department Of Electronics And Electrical Engineering Keio University
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MIZUNO Masayuki
NEC Corporation
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YOSHIDA Yoichi
Keio University, Department of Electronics and Electrical Engineering
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YAMAGISHI Nobuhiko
Keio University, Department of Electronics and Electrical Engineering
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Kuroda Tadahiro
Keio University
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ISHIKURO Hiroyuki
Keio University, Department of Electronics and Electrical Engineering
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FUKAISHI Muneo
NEC Corporation
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Yoshida Yoichi
Keio University
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Yoshida Yoichi
Keio University Department Of Electronics And Electrical Engineering
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三浦 典之
Keio University
著作論文
- Digital Rosetta Stone : A Sealed Permanent Memory with Inductive-Coupling Power and Data Link
- Measurement of Inductive Coupling in Wireless Superconnect
- Constant Magnetic Field Scaling in Inductive-Coupling Data Link
- Daisy Chain Transmitter for Power Reduction in Inductive-Coupling CMOS Link(Analog and Communications,Low-Power, High-Speed LSIs and Related Technologies)
- Constant Magnetic Field Scaling in Inductive-Coupling Data Link
- 60% Power Reduction in Inductive-Coupling Inter-Chip Link by Current-Sensing Technique
- A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology (Interface and Interconnect Techniques, VLSI Design Technology in the Sub-100nm Era)