806 パッチ型LPCVD装置を用いたシリコンウエハ薄膜形成に関する影響因子解析(G06-2 熱物性・加工,G06 熱工学)

概要

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The paper investigates major parameters controlling the film deposition rate and the step coverage in batch type LPCVD devices. Based on the basic equations on the film deposition rate and by the selection of major parameters in the equations, p/u_0 parameter was estimated as the controlling parameter for both film deposition rate and step coverage at constant temperature condition. The result of the experiment agreed to the prediction in first order accuracy. The result indicates that the film deposition rate increases as the increase of the p/u_0 parameter, but it deteriorates step coverage. This implies the improvement of both deposition rate and step coverage is not accomplished by controlling pressure and flow.
一般社団法人日本機械学会の論文
2005-09-18