X-Ray Mask Inspection Using Replicated Resist Patterns
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概要
- 論文の詳細を見る
A new X-ray mask inspection method using replicated resist patterns is proposed. It is able to detect fatal opaque defects on the back surface of the mask and at the bottom of the hole pattern, in addition to those on the front surface. It can also ignore transparent defects on the mask. This method is useful even for defect detectionon a single-die mask through die-to-die comparison. For the false process defects occurring during the replication process, a discrimination procedure using a 2-step die-to-die comparison is proposed. In inspection tests with SEMSpec, we investigate the relation between the detection sensitivity to small resist defects and the conductive-coating thickness on them.
- 社団法人応用物理学会の論文
- 1994-12-30
著者
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MATSUDA Tadahito
NTT LSI Laboratories
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MATSUDA Tadahito
NTT System Electronics Laboratories
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Okada Ikuo
Ntt Lsi Laboratories
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Matsuda T
Ntt Telecommunications Energy Laboratories
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Matsuda T
Tokyo Inst. Technol. Tokyo Jpn
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Okada I
Mitubishi Heavy Ind. Ltd. Takasago Jpn
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Shibayama A
Ntt Lsi Lab. Kanagawa Jpn
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Shibayama Akinori
Ntt Lsi Laboratories
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TSUYUZAKI Haruo
NTT LSI Laboratories
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SEKIMOTO Misao
NTT LSI Laboratories
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Tsuyuzaki H
Ntt Lsi Laboratories
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Sekimoto M
Ntt Lsi Laboratories
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