清浄零囲気中で作製したNi-Fe/Cu多層スパッタ膜の構造とGMR効果

概要

論文の詳細を見る
The relation between the ry-etching time of the substrate an the magnetoresistance (MR) is discussed for Ni-Fe/Cu nultilayers fabricated by a facing-targers sputtering method. The role of the unerlying, Ta, Fe, Ni-Fe, or Ni-Fe fabricated in an N_2 mixed sputtering atmosphere (Ni-Fe(N_2)), is also discussed from the viewpoint of the relation between the microstructure and the GMR properties.Dry etching of the substrate surface with RF plasma before film deposition results in aa remarkable increase in the MR ratio.An underlying 30-A-thick Ta layer increaded the MR ratio, while a 5-A-thick Ni-Fe(N_2)under increased the MR ratio, while a 5-A-thick Ni-Fe(N_2) underlayer decreased it.From an analysis of the structure and magnetic properties of the multilayers, it is concluded that enlargement of the grain diameter in the multilayers le to an enhancement of interlayer magnetic coupling, and resulted in the remarkable increase in the MR ratio
社団法人日本磁気学会の論文
1998-04-15