Co/Cu多層膜のGMR効果に及ぼす基板エッチングの影響 (<特集>多層膜・人工格子・グラニューラー)

概要

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The correlation between the cleanness of the substrate and the magnetoresistance (MR) is discussed for Co/Cu multilayers fabricated by a facing-targets sputtering method. Dry-etching of the substrate surface with RF plasma before film deposition results in a remarkable increase in the MR ratio, espedially in multilayers whose Cu space layer thickness (d_<cu>) is from 9A to 11A. From an analysis of the structure and magnetic properties of multilayers, it was concluded that an enlargement of the grain diameter in the multilayers led to an enhancement of the interlayer magnetic coupling, and resulted in the remarkable increase in the MR ratio. An exposing study of dry-etched substrates under various atmospheres, confirmed that dry-etching desorbed H_O and/or O_2 gases from the surface and enhanced the mobility of sputtered adatoms on it.
社団法人日本磁気学会の論文
1997-04-15