スパッタ法ならびに蒸着法で作製したCu薄膜の初期成長過程

概要

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Microstructural changes in the initial growth stage of Cu films fabricated by sputtering and evaporation are discussed. During and after deposition, the amplitude V of surface acoustic waves (SAWs) propagated on the piezoelectric substrate through the films deposited on it, and the electrical sheet resistivity of the films, R_<sq>, were measured. The surface morphology of the films was examined by using an atomic force microscope. As a result, it was found that (1) the critical thicknesses d_p, at which the islands of a film begin to percolate, and d_c, at which the film becomes two-dimensionally continuous, are smaller in sputter-deposited films than in evaporated ones; (2) the surface roughness of sputter-deposited films is smaller than that of evaporated films; and (3) microstructural change that increases the average interisland spacing is harder to achieve in sputter-deposited films than in evaporated ones.
社団法人日本磁気学会の論文
1999-04-15