ガスフロースパッタ法とグラニュラー磁性体の合成

概要

論文の詳細を見る
Gas flow sputtering(GFS)is a high-pressure sputtering process in the range of 1Torr that has characteristics between PVD and CVD. The method is based on a hollow cathode discharge and a directed forced flow of processing gas. It has the following useful features:deposition of atoms with very low kinetic energies(<0.1 eV), high deposition rates, a flux-determined material transport, and applicability to a wide range of coating materials. Moreover, it can be applied to the production of various clusters (small particles) and their in-situ deposition onto a substrate for producing nanostructured materials. In this article, the principle of GFS is presented, and the in-situ production of granular magnetic materials, especially Fe/Ag granular films, using this technique is also demonstrated.
社団法人日本磁気学会の論文
2000-11-01