半導体基板の非接触研磨技術

概要

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In order to obtain a high precision and damage free semiconductor Si wafer used for large scale integrated circuits, a new polishing machine was developed, Using this machine, the wafers never come into contact with the polishing pad but are supported by the liquid. The polishing pad has several taper-fiat radial divisions like a hydro-dynamic thrust bearing. Rotating this pad in the liquid, the wafers with flat surfaces float to the pad through hydrodynamic effect. Powder particles in the liquid polish the wafer sur, face little by little. Special merits in this polishing method are as follow. The work surface is not affected by large particles in polishing reagent, and polisher wear or deformation does not happen, so a high precision and damage free surface can be obtained reproducibly. The polished Si wafer using this machine has I μm/3'' in flatness, lOA surface roughness and one order less defect than that of a conventionally polished wafer. The Schottky-barrier diode formed on this polished wafer has no leakage in reverse current.
社団法人精密工学会の論文
1983-05-05