ダイボンディング用導電性接着剤のリフロー工程の破壊強度評価

概要

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Strength evaluation of conductive adhesive paste for die bonding during reflow soldering is important, as the fracture in the paste is one of the main causes of package failure. First, we assumed that the fracture was caused by thermal stress and vapor pressure at the interface between the resin and the copper lead frame. Next, we measured the fracture strength of a bonded specimen with the paste using a three-point bending test. Then, we calculated the stress intensity factor of a corner in the paste during the reflow soldering process. Finally, we compared it with the fracture strength of the paste, and evaluated the possibility of the fracture in the paste. The strength evaluation analysis results were consistent with the results of the package reflow test. Therefore, we confirmed that the fracture in the paste can be predicted with a high accuracy by using this method.
2010-10-25