電子部品の微細はんだ接続強度に及ぼす垂直応力の影響

概要

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In flip-chip packages, bending deformation of the chip and substrates causes normal stress in the solder joints. In this paper, we study the influence of such normal stress on the flip-chip joint strength. Static loading tests and cyclic bending tests were conducted on flip-chip packages. The static loading test showed that long term loading on the flip-chip joints causes debonding at the interface between the solder bumps and the metal pads on the LSI chips. The cyclic loading test showed that such debonding also occurs under cyclic loading, and that the strain causing such a failure mode is much less than that causing solder fatigue fracture. The relation between the number of cycles to the failure of the debonding at the interface and the static loading test data is investigated, taking stress relaxation caused by creep strain into consideration.
社団法人日本機械学会の論文
2002-03-25