2相流モデルを用いたCMPにおける回転パッド上のスラリー液膜流動数値解析(流体工学,流体機械)

概要

論文の詳細を見る
Chemical mechanical polishing (CMP) is a very precise planarization technique where a wafer is polished by a pad. Slurry is dropped on the rotating pad surface and is supplied between the wafer and the pad. This research aims at reducing the slurry consumption and supplying fresh slurry evenly under the wafer. Grooves on pad are expected to supply slurry evenly and to remove wasted particles. Our objective is to develop the design of the best patterns of grooves using computational fluid dynamics (CFD). In this paper slurry flow is studied using the volume of fluid method (two phase model for gas and liquid). Slurry flow simulations were carried for flat pad, for circularly grooved pad, for various flow rate and slurry supply position.
社団法人日本機械学会の論文
2008-11-25