Studies of Corrosive Outgasses from Via Holes Using Thermal Desorption Spectroscopy
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概要
- 論文の詳細を見る
This work reveals the presence of corrosive outgassing from via holes in multiinterdielectric structures with inorganic spin-on-glass (SOG) films using thermal desorption spectroscopy. Main species of the corrosive outgassing are found to be H_2O, NH_3 and HF. The amount of NH_3 desorption reaches 5-10% of water desorption. Significant amounts of H_2O and NH_3 are found to be desorbed from the SOG films. The desorption of NH_3 results from occlusion of the species into the SOG film through the via holes.
- 社団法人応用物理学会の論文
- 1995-02-28
著者
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Hirashita N
Oki Electric Industry Co. Ltd. Vlsi R&d Center
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Hirashita Norio
Vlsi Research And Development Center Oki Electric Industry Co. Ltd.
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Hirashita Norio
Vlsi R&d Center Oki Electric Industry Co. Ltd.
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Liu Guo-lin
Vlsi Research And Development Center Oki Electric Industry Co. Ltd.
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UCHIDA Hidetsugu
VLSI R&D Center, Oki Electric Industry Co., Ltd.
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Tokitoh Shunichi
VLSI Research and Development Center, Oki Electric Industry Co., Ltd.
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Uchida Hiroaki
Process Technology Center, Oki Electric Industry Co., Ltd.
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Okuno Yasuyuki
Process Technology Center, Oki Electric Industry Co., Ltd.
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Fushimi Kimihisa
Process Technology Center, Oki Electric Industry Co., Ltd.
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Sakaya Yoshihiro
Process Technology Center, Oki Electric Industry Co., Ltd.
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Okuno Yasuyuki
Process Technology Center Oki Electric Industry Co. Ltd.
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Tokitoh Shunichi
Vlsi Research And Development Center Oki Electric Industry Co. Ltd.
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Fushimi Kimihisa
Process Technology Center Oki Electric Industry Co. Ltd.
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Sakaya Yoshihiro
Process Technology Center Oki Electric Industry Co. Ltd.
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UCHIDA Hidetsugu
VLSI R&D Center, Oki Electric Industry Co., Ltd.
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