Improved Heat Treatment for Wafer Direct Bonding between Semiconductors and Magnetic Garnets
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概要
- 論文の詳細を見る
The optical propagation loss of rib waveguides fabricated on magnetic garnet films increased upon annealing in H_2 ambient during wafer direct bonding. The heat treatment in wafer direct bonding between InP and Gd_3Ga_5O_<12> was investigated with the aim of circumventing the loss increase. The bonding was achieved by heat treatment in H_2 ambient at temperatures of ≦ 330℃ or in N_2 ambient.
- 社団法人応用物理学会の論文
- 1997-05-15
著者
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MIZUMOTO Tetsuya
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology
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Naito Yoshihiko
Institute Of Space And Astronautical Science
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Yokoi Hideki
Department of Biochemistry, College of Agriculture, Kyoto Prefectural University
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Yokoyama H
Tokyo Inst. Technol. Yokohama Jpn
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Yokoi H
Tokyo Inst. Technol. Tokyo Jpn
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Yokoi Hideki
Department Of Electrical And Electronic Engineering Graduate School Of Science And Engineering Tokyo
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Yokoi H
Graduate School Of Science And Engineering Tokyo Institute Of Technology
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NAITO Yoshiyuki
Department of Anesthesia, Kobe City General Hospital
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Naito Y
Kobe City General Hospital Kobe Jpn
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Naito Yoshiyuki
Department Of Anesthesia Kobe City General Hospital
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Maru Kouichi
Department Of Physical Electronics Faculty Of Engineering Tokyo Institute Of Technology
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MARU Koichi
Department of Physical Electronics, Faculty of Engineering, Tokyo Institute of Technology
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Mizumoto T
Tokyo Inst. Technol. Tokyo Jpn
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Mizumoto Tetsuya
Department Of Eee Tokyo Institute Of Technology
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Yokoi H
Department Of Electrical And Electronic Engineering Graduete School Of Science And Engineering Tokyo
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MARU Koichi
Department of Electronics and Information Engineering, Faculty of Engineering, Kagawa University
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