Direct Bonding between InP Substrate and Magnetooptic Waveguides
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概要
- 論文の詳細を見る
Wafer direct bonding was demonstrated between InP and magnetooptic materials. The effects of chemical treatment of two wafers before placing them into contact were investigated in order to enhance the durability of the bonded wafers through the various device fabrication processes. Phosphoric acid etching at a low temperature proved to be the most suitable treatment for the bonding between InP and gadolinium gallium garnet Gd_3Ga_5O_12. In the case of this treatment, the bonding was studied between a planar InP substrate and magnetooptic waveguides on the garnet films.
- 社団法人応用物理学会の論文
- 1996-07-15
著者
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MIZUMOTO Tetsuya
Department of Electrical and Electronic Engineering, Tokyo Institute of Technology
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Naito Yoshihiko
Institute Of Space And Astronautical Science
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Yokoi Hideki
Department of Biochemistry, College of Agriculture, Kyoto Prefectural University
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Yokoyama H
Tokyo Inst. Technol. Yokohama Jpn
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Yokoi H
Tokyo Inst. Technol. Tokyo Jpn
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Yokoi Hideki
Department Of Electrical And Electronic Engineering Graduate School Of Science And Engineering Tokyo
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Yokoi H
Graduate School Of Science And Engineering Tokyo Institute Of Technology
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NAITO Yoshiyuki
Department of Anesthesia, Kobe City General Hospital
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Naito Y
Kobe City General Hospital Kobe Jpn
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Naito Yoshiyuki
Department Of Anesthesia Kobe City General Hospital
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Maru Kouichi
Department Of Physical Electronics Faculty Of Engineering Tokyo Institute Of Technology
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MARU Koichi
Department of Physical Electronics, Faculty of Engineering, Tokyo Institute of Technology
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FUKE Nobutaka
Department of Physical Electronics, Faculty of Engineering, Tokyo Institute of Technology
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Fuke Nobutaka
Department Of Physical Electronics Faculty Of Engineering Tokyo Institute Of Technology
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Mizumoto T
Tokyo Inst. Technol. Tokyo Jpn
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Mizumoto Tetsuya
Department Of Eee Tokyo Institute Of Technology
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Yokoi H
Department Of Electrical And Electronic Engineering Graduete School Of Science And Engineering Tokyo
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MARU Koichi
Department of Electronics and Information Engineering, Faculty of Engineering, Kagawa University
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