Effect of 300mm Wafer Transition and Test Processing Logistics on VLSI Manufacturing Final Test Process Efficiency and Cost

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概要

• 論文の詳細を見る

• The effect of lot size change and test processing logistics on VLSI manufacturing final test process efficiency and cost due to the transition of from conventional 5 or 6 inches to 300 mm (12 inches) in wafer size is evaluated through simulation analysis. Simulated results show that a high test efficiency and a low test cost are maintained regardless of arrival lot size in the range of the number of 300 mm wafers per lot from 1 to 25 and the content of express lots in the range of up to 50% by using WEIGHT+RPM rule and the right final test processing logistics. WEIGHT+RPM rule is the rule that considers the jig and temperature exchanging time, the lot waiting time in queue and also the remaining processing time of the machine in use. The logistics has a small processing and moving lot size equal to the batch size of testing equipment.

• 社団法人電子情報通信学会の論文
• 1999-04-25

著者

• FUJIOKA Hiromu

  Department of Information Systems Engineering, Faculty of Engineering, Osaka University

• Nakamae K

  Osaka Univ. Suita‐shi Jpn

• Nakamae Koji

  Faculty Of Engineering Osaka University

• Fujioka H

  Osaka Univ. Suita‐shi Jpn

• Fujioka Hiromu

  Faculty Of Engineering Osaka University

• CHIKAMURA Akihisa

  Faculty of Engineering, Osaka University

• Chikamura Akihisa

  Faculty Of Engineering Osaka University

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