LSI Failure Analysis with CAD-Linked Electron Beam Test System and Its Cost Evaluation (Special Issue on LSI Failure Analysis)
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概要
- 論文の詳細を見る
Following a discussion of various testing methods used in the electron beam (EB) test system, new waveform-based and image-based approaches in the CAD-linked electron beam (EB) test system are proposed. A waveform-based automatic tracing algorithm of the transistor-level performance faults is first discussed. Then, the method to improve the efficiency of an image-based method called dynamic fault imaging (DFI) by fully utilizing the CAD data is described. Third, the VLSI development cost is analyzed by using the fault models that make possible to take into consideration the effect of new testing technologies such as EB testing and focused ion beam (FIB) microfabrication. Finally, the future prospects are discussed.
- 社団法人電子情報通信学会の論文
- 1994-04-25
著者
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Nakamae Koji
Faculty Of Engineering Osaka University
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Fujioka Hiromu
Faculty Of Engineering Osaka University
関連論文
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- Effect of 300mm Wafer Transition and Test Processing Logistics on VLSI Manufacturing Final Test Process Efficiency and Cost
- Effect of Express Lots on Production Dispatching Rule Scheduling and Cost in VLSI Manufacturing Final Test Process
- Hierarchical Fault Tracing for VLSIs with Bi-directional Busses from CAD Layout Data in the CAD-Linked EB Test System
- Automatic Transistor-Level Performance Fault Tracing by Successive Circuit Extraction from CAD Layout Data for VLSI in the CAD-Linked EB Test System
- Matching of DUT Interconnection Pattern with CAD Layout in CAD-Linked Electron Beam Test System (Special Issue on LSI Failure Analysis)
- Automatic Tracing of Transistor-Level Performance Faults with CAD-Linked Electron Beam Test System
- LSI Failure Analysis with CAD-Linked Electron Beam Test System and Its Cost Evaluation (Special Issue on LSI Failure Analysis)
- Efficient Dynamic Fault Imaging by Fully Utilizing CAD Data in CAD-Linked Electron Beam Test System (Special Issue on LSI Failure Analysis)