An Analysis of the Economics of the VLSI Development Including Test Cost
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概要
- 論文の詳細を見る
In order to evaluate the effect of testing technologies such as electron beam (EB) testing and focused ion beam (FIB) reconstruction on the VLSI development cycle, the VLSI development period and cost are analyzed by using detailed fault models which make possible to take into consideration the effect of EB and FIB techniques. First, the specifications of fabricated VLSIs and the VLSI development cycle are modeled. Next the faults which can be diagnosed by such testing techniques are modeled. By using the parametric model of the VLSI development cycle, the development period and cost are analyzed. In the fault diagnosis stage, the use of an EB tester or the combinational use of an EB tester and an FIB equipment, instead of a traditional mechanical prober is considered. It is seen that the development period and cost are reduced by using EB and FIB diagnosis equipments by a factor of about 3. The effect of scan path method is also evaluated by making use of the same simulation method. Results show that the scan path design is effective for the reduction in both period and cost in the development cycle.
- 社団法人電子情報通信学会の論文
- 1994-04-25
著者
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Nakamae Koji
Faculty Of Engineering Osaka University
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Fujioka Hiromu
Faculty Of Engineering Osaka University
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Sakamoto Homare
Faculty of Engineering, Osaka University
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Sakamoto Homare
Faculty Of Engineering Osaka University
関連論文
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- Effect of Express Lots on Production Dispatching Rule Scheduling and Cost in VLSI Manufacturing Final Test Process
- Hierarchical Fault Tracing for VLSIs with Bi-directional Busses from CAD Layout Data in the CAD-Linked EB Test System
- Automatic Transistor-Level Performance Fault Tracing by Successive Circuit Extraction from CAD Layout Data for VLSI in the CAD-Linked EB Test System
- Matching of DUT Interconnection Pattern with CAD Layout in CAD-Linked Electron Beam Test System (Special Issue on LSI Failure Analysis)
- Automatic Tracing of Transistor-Level Performance Faults with CAD-Linked Electron Beam Test System
- LSI Failure Analysis with CAD-Linked Electron Beam Test System and Its Cost Evaluation (Special Issue on LSI Failure Analysis)
- Efficient Dynamic Fault Imaging by Fully Utilizing CAD Data in CAD-Linked Electron Beam Test System (Special Issue on LSI Failure Analysis)