Fabrication and Noise Reduction of the Miniature Tactile Sensor Using Through-Silicon-Via Connection with Signal Amplifier
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概要
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A miniature tactile sensor has been fabricated by connecting stress-sensitive part with an amplifier of integrated circuit through through-silicon-via (TSV) electrically. The sensitive part consists of three warped cantilevers with piezoresistive NiCr thin film which are prepared on a silicon-on-insulator wafer by the surface micromachining technique. The TSV connection can reduce noise of detected change of the piezoresistive output induced by wire between the sensitive part and the amplifier. Fabricated tactile sensor of 5\times 5 mm<sup>2</sup>size has linear dependence of the output on both normal and shear forces. The output noise has been successfully decreased by 14 and 34% in the sensor using the TSVs compared with that using wires of 3 and 6 mm lengths, respectively.
- 2013-06-25
著者
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Sohgawa Masayuki
Graduate School Of Engineering Science Osaka University
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Kanashima Takeshi
Graduate School Of Engineering Science Osaka University
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Okuyama Masanori
Institute for NanoScience Design, Osaka University, Toyonaka, Osaka 560-8531, Japan
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Noma Haruo
Advanced Telecommunication Research Institute International, Seika, Kyoto 619-0288, Japan
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Azuma Teruaki
Nitta Corporation, Chuo, Tokyo 104-0061, Japan
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Yokoyama Hokuto
Graduate School of Engineering Science, Osaka University, Toyonaka, Osaka 560-8531, Japan
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