無電解ニッケルによるアルミニウム上への直接回路形成

概要

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Electroless nickel plating on aluminum substrates utilizing a nickel displacement process has been investigated.A zincate process is in general use before electroless nickel plating on aluminum substrates. It has been confirmed, however, that the film of deposited nickel exhibits higher adhesion strength if a nickel displacement process is used instead of the zincate process, and that adhesion strength depends on the rate of the displacement reaction, which can be controlled by changing the kind of complexing agent and the plating conditions in the displacement bath.In addition, fine bumps are required in the TAB or flip chip bonding methods and straight-walled bumps approximately 20μm wide and 15μm high can be formed by electroless nickel deposition utilizing the displacement process.
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