Pd混合触媒に代わる無電解めっき用Cu混合触媒の検討

概要

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A PdCl2/SnCl2 mixed catalyst is generally used for the initiation of or pretreatment for electroless copper plating on non-conductive substrates. However, this procedure has become expensive because of the increase in the cost of a Pd metal. Furthermore, the remains of Pd on a substrate surface induce electrical problems in fine and dense circuit patterns. In this study, we have developed a new catalyzing process using a mixture of copper and tin salts instead of the Sn-Pd mixed catalyst. This catalyst has showed much the same performance as the Sn-Pd catalyst, where a uniform copper film was deposited on an epoxy resin. An adhesion strength larger than 1.0kN/m was achieved. The new catalyst process is suitable for forming fine line patterns without extraneous deposition since copper is easily removed from the resin surface.
社団法人表面技術協会の論文
2008-09-01