1845 ポリシリコン薄膜微小機械要素の曲げ負荷によるヤング率測定と強度評価(J09-1 マイクロ構造・材料の強度評価,J09 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

概要

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The Young's modulus of a poly-Si thin microelement was evaluated using a newly developed mechanical testing system for thin film under bending. The system is based upon a Nano Indenter with a specially designed indenter and an ultra-precise positioning stage. The bending samples tested were 3.8μm thick, 5μm wide, and 20μm long. The Young's modulus of the poly-Si thin film was 157±6 GPa and the bending strength was 4.2±0.1GPa, with a help of FEM analysis. To estimate the Young's modulus, three-dimensional finite element models were adopted using a Voronoi structure. The crystal orientation of the film was analyzed by means of an electron back-scattering diffraction pattern (EBSP) method. The front and side surfaces of the film had no texture, and therefore, random crystal orientation was given to each grain of the FEM models. The Young's modulus obtained by the FEM analyses was about 160GPa, which was almost the same as that obtained by the bending experiments.
2005-09-18