114 ポリシリコン薄膜の結晶方位解析とヤング率の有限要素解析(セッション4)

概要

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The Young's modulus of poly-silicon thin microelement was evaluated using the previously developed mechanical testing system for thin tensile microelements. The testing system consists of a tensile and fatigue testing machine actuated by a PZT driven positioning stage, a micro manipulation system, a non-contact strain measurement system with a help of a double-filed-of-view microscope. The tested part of the specimen is 250μm in length, 10μm in width, 3.8μm in thickness. The Young's modulus of the tested poly-silicon thin specimen was 133±10 GPa. To analyze the effect of the crystal orientations and the grain size on the Young's modulus, finite element models were developed, based on the crystal orientation analysis of the specimen by means of electron back-scattering diffraction pattern method. Random orientation was given to each grain. When the number of grains increased, the Young's modulus converged on about 170GPa, which was larger than the value obtained by the tensile tests.
2005-03-13