相変化材を用いた高発熱パッケージ冷却技術の開発 : 熱回路網法の相変化現象解析への応用

概要

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This paper describes one of the new package cooling concepts using a phase-changing-material (PCM), to be applied for the development of high-density packaging. A low-cost alloy, composed of Bi/Pb/Sn/In, the melting points of each of the elements of which are less than 70℃, was used as the PCM. Experiments were conducted using this alloy and thermal network method was applied for the analysis of phase-changing phenomena. It was confirmed that the surface temperature of the opposite side of the substrate could be fixed at the PCM's melting temperature for several minutes by thermal absorption effect while the PCM phase changed from its original solid state into the liquid state. It has also been confirmed, in the present work, that thermal network method could be used as a personal computer base engineering tool for the thermal design of a package with a PCM.
一般社団法人日本機械学会の論文
1994-06-25