光部品接着用樹脂の吸湿性

概要

論文の詳細を見る
Semiconductor optical device packages require precise positioning of submicron meter order and long term stability. When adhesive resin made of organic material is used to fix optical parts, one important concern is that it may reduce the stability of the packages. To clarify the moisture attack in adhesive resin, the material properties of the widely-used adhesive epoxy resin for optical parts fabrication have been investigated here by exposing it to high temperature and humidity. Length, weight, transition temperature and thermal expansion were measured in reliable test conditions of semiconductor packages. It is shown that severe degradation is caused when humidity is combined with conditions of high temperature. The decrement of transition temperature was expressed by a logarithmic equation in the range of 1000 hours. It was revealed that the degradation of epoxy resin was closely connected with the semiconductor laser package's power life.
社団法人エレクトロニクス実装学会の論文
2001-11-01