起電力による微細はんだボールの変形評価 : 微細接続部の変形測定法の基礎検討

概要

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Our objective is to develop an effective method for measuring deformation in small solder ball joints. We focused on the Zeebeck Effect, which is characterized by electromotive force (E_mf) in thermo-coupling and tried to measure E_mf when the solder ball was deformed. A Cu wire-Solder ball-Cu/Ni wire arrangement was made. Usually a thermocouple connection for temperature measurement has two different metal wires directly facing each other. But, for our experiments a third metal, i.e., solder, was sandwiched between the two-thermocouple wires. The diameter of the solder ball was 1.3 mm. When an E_mf was generated and measured at various deformation speeds of the solder ball, we found that the E_mf increased as the deformation increased. Furthermore, the E_mf changed in relation to the load cycling magnitude. We demonstrated that the proposed E_mf measuring method can be a useful and powerful tool for the deformation evaluation of real solder connections.
社団法人日本機械学会の論文
2002-05-25