Microstructure Evolution of the TaN_x (x = 0-1) Diffusion Barriers by NH_3 Plasma Treatment for the Electroless Copper Deposition

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概要

• 論文の詳細を見る
• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2004-10-15

著者

• LEE Yong

  Division of Life Sciences, Korea Institute of Science and Technology

• Park J‐w

  Sungkyunkwan Univ. Suwon Kor

• Lee Y

  Department Of Metallurgical Engineering Yonsei University

• Park Jong-wan

  Division Of Materials Science And Engineering Hanyang University

• Hong Seok

  Division Of Materials Science And Engineering Hanyang University

• Park J‐w

  Department Of Pharmacology Seoul National University College Of Medicine

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