Microstructure Evolution of the TaNx ($x=0--1$) Diffusion Barriers by NH3 Plasma Treatment for the Electroless Copper Deposition
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概要
- 論文の詳細を見る
Microstructure evolution during NH3 plasma treatment of the surface of TaNx barrier films was investigated using transmission electron microscopy (TEM) in order to understand how the plasma treatment improves the palladium activation process for electroless copper deposition. Plan view TEM and selected area diffraction pattern (SADP) results showed that the outermost surface of the crystalline TaNx layer was transformed to the amorphous phase by the NH3 plasma treatment. The surface energy, evaluated by contact angle measurement, of TaNx films was increased by the NH3 plasma treatment. The increase in the surface energy of TaNx films by the plasma treatment seems to increase the nucleation sites for palladium activation. It is thought that the enhancement of the palladium activation process by the NH3 plasma treatment was caused by an increase in the surface energy of TaNx films during the plasma treatment.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-10-15
著者
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Park Jong-wan
Division Of Materials Science And Engineering Hanyang University
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Hong Seok
Division Of Materials Science And Engineering Hanyang University
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Lee Yong
Division Of Applied Life Science Graduate School Gyeongsang National University
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Hong Seok
Division of Materials Science and Engineering, Hanyang University, 17 Haengdang-dong, Seongdong-ku, Seoul 133-791, Korea
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