Dielectric Constant Stability and Thermal Stability of Cu/Ta/SiOF/Si Multilayer Films

スポンサーリンク

概要

著者

関連論文

Diffusion Barrier Property of Molybdenum Nitride Films for Copper Metallization
Improvement of the Reliability of a Cu/W-N/SiOF Multilevel Interconnect by Inserting Plasma Enhanced Chemical Vapor Deposited W-N Thin Film
N_2^+ Implantation Approaches for Improving Thermal Stability of Cu/Mo/Si Contact Structure
Curcumin attenuates cytochrome P450 induction in response to 2,3,7,8-tetrachlorodibenzo-p-dioxin by ROS-dependently degrading AhR and ARNT
Dielectric Constant Stability and Thermal Stability of Cu/Ta/SiOF/Si Multilayer Films
Effects of Chemical Interaction between Ta and SiOF on the Crystallinity of Cu and Ta in Cu/Ta/SiOF Films
Hypoxia-Inducible Factor 1-Related Diseases and Prospective Therapeutic Tools
Electroless Copper Deposition on H_2 Plasma-Treated TaN_x (x = 0-1) Diffusion Barriers
Microstructure Evolution of the TaN_x (x = 0-1) Diffusion Barriers by NH_3 Plasma Treatment for the Electroless Copper Deposition
Surface Modification of Low Dielectric Fluorinated Amorphous Carbon Films by Nitrogen Plasma Treatment : Electrical Properties of Condensed Matter
Effect of Post-Plasma Treatment Time on the Properties of Low Dielectric Fluorinated Amorphous Carbon Films
Effect of Post-Plasma Treatment Time on the Properties of Low Dielectric Fluorinated Amorphous Carbon Films
Dielectric Constant Stability and Thermal Stability of Cu/Ta/SiOF/Si Multilayer Films
Improvement of the Reliability of a Cu/W–N/SiOF Multilevel Interconnect by Inserting Plasma Enhanced Chemical Vapor Deposited W–N Thin Film
Microstructure Evolution of the TaNx ($x=0--1$) Diffusion Barriers by NH3 Plasma Treatment for the Electroless Copper Deposition

もっと見る

スポンサーリンク