Choi Siyoung | Process Development Team Memory Division Samsung Electronics Co. Ltd.
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概要
- CHOI Siyoungの詳細を見る
- 同名の論文著者
- Process Development Team Memory Division Samsung Electronics Co. Ltd.の論文著者
関連著者
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Choi Siyoung
Process Development Team Memory Division Samsung Electronics Co. Ltd.
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Choi Siyoung
Process Development Team, Memory Division, Semiconductor Business, Samsung Electronics Co., Ltd.
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Chung U-in
Process Development Team Memory Division Samsung Electronics Co. Ltd.
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Lee Deok-hyung
Process Development Team Memory Division Samsung Electronics Co. Ltd.
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Lee Byeong-chan
Process Development Team Memory Division Samsung Electronics Co. Ltd.
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Choi S
Samsung Electronics Co. Ltd. Kyunggi‐do Kor
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Choi Siyoung
Process Development Team Semiconductor R&d Division Samsung Electronics Ltd.
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Lee Deok-hyung
Process Development Team Memory Division Semiconductor Business Samsung Electronics Co. Ltd.
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CHUNG U-In
Process Development Thani, Semiconductor R&D Division, Sam suns Uectronics Co., Ltd.
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Lee Byeong-chan
Process Development Team Memory Division Semiconductor Business Samsung Electronics Co. Ltd.
著作論文
- SiGe Source and Drain for Performance Boosting of Peripheral PMOS Transistor in High Density 4 Gb DRAM Technologies(Session 7A Silicon Devices IV,AWAD2006)
- SiGe Source and Drain for Performance Boosting of Peripheral PMOS Transistor in High Density 4 Gb DRAM Technologies(Session 7A Silicon Devices IV,AWAD2006)
- SiGe Source and Drain for Performance Boosting of Peripheral PMOS Transistor in High Density 4Gb DRAM Technologies
- Formation of High-Temperature Stable Co-Silicide from Co_Ta_/Si Systems
- The Formation of High Temperature Stable Co-Silicide from Co_Ta_x/Si Systems
- A Study on the Germano-Silicide Formation in the Ni/Si_Ge_x System for CMOS Device Applications
- FEOL Process for Sub-100nm DRAM
- FEOL Process for Sub-100nm DRAM
- Performance of DRAM Cell Transistor with Thermal Desorption Silicon Etching (TDSE) and Selective Si Channel Epi Techniques
- Performance of DRAM Cell Transistor with Thermal Desorption Silicon Etching (TDSE) and Selective Si Channel Epi Techniques