Fabrication of (Ba0.6,Sr0.4)TiO3 Thick Films by Aerosol Deposition Method for Application to Embedded Multilayered Capacitor Structures
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概要
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(Ba0.6,Sr0.4)TiO3 thick films were fabricated on Pt/Ti/SiO2/Si, stainless steel (SUS) and Cu substrates by aerosol deposition (AD) technique. The effect of substrate on physical and electrical properties of the fabricated films has been studied. The AD-formed films have an average grain size of 15.9 to 18.3 nm, substrate having a small effect on its value. Strain is affected by the substrate selection and it is smallest when Cu has been selected as the metal substrate for AD of (Ba0.6,Sr0.4)TiO3 powder, having a value of 0.00552. The leakage current of (Ba0.6,Sr0.4)TiO3 thick films deposited on Cu substrates is smaller that for films deposited on Pt/Ti/SiO2/Si and SUS substrates being less than $10^{-7}$ A/cm2 at 200 kV/cm applied electric field. The above results indicate that Cu is a good candidate for metallization in multilayered capacitor structure fabrication when AD technique is used for dielectric film formation.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2008-09-25
著者
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Tsuda Hiroki
National Institute of Advanced Industrial Science and Technology (AIST)
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Akedo Jun
National Inst. Of Advanced Industrial Sci. And Technol. (aist) Ibaraki Jpn
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Tsuda Hiroki
National Institute of Advanced Industrial Science and Technology, Tsukuba, Ibaraki 305-8564, Japan
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Popovici Daniel
National Institute of Advanced Industrial Science and Technology, Tsukuba, Ibaraki 305-8564, Japan
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Popovici Daniel
National Institute of Advanced Industrial Science and Technology, 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
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