Fabrication of Stainless Steel Mold Using Electrochemical Fabrication Method for Microfluidic Biochip

スポンサーリンク

概要

• 論文の詳細を見る

• Imprinting method mechanically transfers patterns from a stamp onto a substrate. In imprinting process, the mold is one of the most important factors. A new micro fabrication method termed electrochemical fabrication (ECF) is introduced to overcome conventional problems of electrical discharge machining (EDM), FeCl3 Wet etching, laser method, electro plating, such as low reliability and reproducibility, high cost. This ECF method defines micro patterns using a conventional photolithography, allowing it to produce micro-scale patterns with an excellent surface roughness and of excellent quality. In this paper, a 150 mm stainless steel (SUS 304, 5 mm in thickness) mold was fabricated using both ECF method and FeCl3-etchant method, respectively. As a result, the ECF mold resulted 10 times better surface roughness values than that of mold using FeCl3 etchant. Also, metal surface of the ECF-SUS mold was cleaner and smoother than that the FeCl3 etched SUS mold. Therefore, SUS mold was successfully fabricated for the first time in micro-scale and multi-step patterns. Plastic replica was fabricated successfully using the ECF-SUS mold.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2008-06-25

著者

• Park Jin-goo

  Department Of Metallurgy And Materials Engineering Center For Electronic Materials And Components Ha

• Lim Hyun-woo

  Department Of Metallurgy And Materials Engineering Micro Biochip Center Hanyang University

• Lee Caroline

  Department Of Biochemistry National University Of Singapore

• Cho Byung-Ki

  Standard Diagnostics, Inc., 156-68 Hagal-ri, Giheung-eup, Yongin 449-906, Korea

• Lee Caroline

  Department of Materials Engineering, Hanyang University, Ansan 426-791, Korea

• Cho Min-Soo

  Department of Bio-Nano Technology and Micro Biochip Center, Hanyang University, Ansan 426-791, Korea

• Lim Hyun-Woo

  Department of Bio-Nano Technology and Micro Biochip Center, Hanyang University, Ansan 426-791, Korea

• Park Jin-Goo

  Department of Bio-Nano Technology and Micro Biochip Center, Hanyang University, Ansan 426-791, Korea

関連論文

• Effect of a Guard-Ring on the Leakage Current in a Si-PIN X-Ray Detector for a Single Photon Counting Sensor
• Effect of a guard-ring on the leakage current in a Si-PIN x-ray detector for a single photon counting sensor (Electron devices: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
• Effect of a guard-ring on the leakage current in a Si-PIN x-ray detector for a single photon counting sensor (Silicon devices and materials: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
• Reaction of Ozone and H_2O_2 in NH_4OH Solutions and Their Reaction with Silicon Wafers
• Point of Use Regeneration of Oxide Chemical Mechanical Planarization Slurry by Filtrations
• Effect of Chemicals and Slurry Particles on Chemical Mechamical Polishing of Polyimide
• Particle Removal and Its Mechanism on Hydrophobic Silicon Wafer in Highly Diluted NH_4OH Solutions with an Added Surfactant : Semiconductors
• Effect of Organic Acids in Copper Chemical Mechanical Planarization Slurry on Slurry Stability and Particle Contamination on Copper Surfaces
• Passivation and Etching of Wafer Surfaces in HF-H_2O_2-WA Solutions
• The Hydrophilization of Process Wafers in Dilute Hydrogen Peroxide Solutions and Ozonated Deionized Water and Its Effects on Defects and Gate Oxide Integrity
• Enhanced fluorescence by controlled surface roughness of plastic biochip (Special issue: Microprocesses and nanotechnology)
• Hepatitis B virus X gene and hepatocarcinogenesis
• Investigation of Mechanical Properties and Elongated Ni Grain Growth in an Al_2O_3-Ni Composite during Low-Energy Ball Milling
• Damage Free Particle Removal from Extreme Ultraviolet Lithography Mask Layers by High Energy Laser Shock Wave Cleaning
• Effect of Alkaline pH on Polishing and Etching of Single and Polycrystalline Silicon
• Reaction of Ozone and H2O2 in NH4OH Solutions and Their Reaction with Silicon Wafers
• The Effect of Hydrogen Peroxide on Frictional and Thermal Behaviors in a Citric Acid-Based Copper Chemical Mechanical Planarization Slurry
• Effective Carbon Contaminant Cleaning Condition Using Ozone Dissolved Water and Megasonic for Ru-Capped Extreme Ultraviolet Lithography Mask
• Fabrication of Large-Area CoNi Mold for Nanoimprint Lithography
• Preparation of Conductive Nanoink Using Pulsed-Wire-Evaporated Copper Nanoparticles for Inkjet Printing
• Fabrication of Stainless Steel Mold Using Electrochemical Fabrication Method for Microfluidic Biochip
• Physical and Chemical Characterization of Reused Oxide Chemical Mechanical Planarization Slurry
• Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance
• Effect of Corrosion Inhibitor, Benzotriazole, in Cu Slurry on Cu Polishing
• The Hydrophilization of Process Wafers in Dilute Hydrogen Peroxide Solutions and Ozonated Deionized Water and Its Effects on Defects and Gate Oxide Integrity
• Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance (Special Issue : Advanced Metallization for ULSI Applications)

もっと見る 閉じる

スポンサーリンク