Point of Use Regeneration of Oxide Chemical Mechanical Planarization Slurry by Filtrations

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概要

• 論文の詳細を見る
• 社団法人応用物理学会の論文
• 2002-11-15

著者

• Park Jin-goo

  Department Of Metallurgy And Materials Engineering Micro Biochip Center Hanyang University

• Park Jin-goo

  Department Of Metallurgy And Materials Engineering Hanyang University

• Park Jin-goo

  Department Of Metallurgy And Materials Engineering Center For Electronic Materials And Components Ha

• Kim Myoung-shik

  Department Of Metallurgy And Materials Engineering Hanyang University

• Woo Sun-woong

  Hynix Semiconductor System Ic R&d Division

• Park Jin-Goo

  Department of Bio-Nano Technology and Micro Biochip Center, Hanyang University, Ansan 426-791, Korea

• Park Jin-Goo

  Department of Metallurgy and Materials Engineering, Hanyang University

関連論文

• Influence of Defect Segregation on the Electrical Properties of Nb-doped SrTiO_3 Grain Boundary Layer
• Effect of a Guard-Ring on the Leakage Current in a Si-PIN X-Ray Detector for a Single Photon Counting Sensor
• Effect of a guard-ring on the leakage current in a Si-PIN x-ray detector for a single photon counting sensor (Electron devices: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
• Effect of a guard-ring on the leakage current in a Si-PIN x-ray detector for a single photon counting sensor (Silicon devices and materials: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
• Influence of Grain boundary Layers on the Dielectric Relaxation of Nb-Doped SrTiO_3
• Reaction of Ozone and H_2O_2 in NH_4OH Solutions and Their Reaction with Silicon Wafers
• Point of Use Regeneration of Oxide Chemical Mechanical Planarization Slurry by Filtrations
• Effect of Chemicals and Slurry Particles on Chemical Mechamical Polishing of Polyimide
• Particle Removal and Its Mechanism on Hydrophobic Silicon Wafer in Highly Diluted NH_4OH Solutions with an Added Surfactant : Semiconductors
• Effect of Organic Acids in Copper Chemical Mechanical Planarization Slurry on Slurry Stability and Particle Contamination on Copper Surfaces
• Passivation and Etching of Wafer Surfaces in HF-H_2O_2-WA Solutions
• The Hydrophilization of Process Wafers in Dilute Hydrogen Peroxide Solutions and Ozonated Deionized Water and Its Effects on Defects and Gate Oxide Integrity
• Enhanced fluorescence by controlled surface roughness of plastic biochip (Special issue: Microprocesses and nanotechnology)
• Damage Free Particle Removal from Extreme Ultraviolet Lithography Mask Layers by High Energy Laser Shock Wave Cleaning
• Effect of Alkaline pH on Polishing and Etching of Single and Polycrystalline Silicon
• Reaction of Ozone and H2O2 in NH4OH Solutions and Their Reaction with Silicon Wafers
• The Effect of Hydrogen Peroxide on Frictional and Thermal Behaviors in a Citric Acid-Based Copper Chemical Mechanical Planarization Slurry
• Effective Carbon Contaminant Cleaning Condition Using Ozone Dissolved Water and Megasonic for Ru-Capped Extreme Ultraviolet Lithography Mask
• Fabrication of Large-Area CoNi Mold for Nanoimprint Lithography
• Fabrication of Stainless Steel Mold Using Electrochemical Fabrication Method for Microfluidic Biochip
• Physical and Chemical Characterization of Reused Oxide Chemical Mechanical Planarization Slurry
• Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance
• Effect of Corrosion Inhibitor, Benzotriazole, in Cu Slurry on Cu Polishing
• The Hydrophilization of Process Wafers in Dilute Hydrogen Peroxide Solutions and Ozonated Deionized Water and Its Effects on Defects and Gate Oxide Integrity
• Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance (Special Issue : Advanced Metallization for ULSI Applications)

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