Effect of Organic Acids in Copper Chemical Mechanical Planarization Slurry on Slurry Stability and Particle Contamination on Copper Surfaces

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概要

• 論文の詳細を見る
• 社団法人応用物理学会の論文
• 2002-03-15

著者

• Park Jin-goo

  Department Of Metallurgy And Materials Engineering Micro Biochip Center Hanyang University

• Park Jin-goo

  Department Of Metallurgy And Materials Engineering Center For Electronic Materials And Components Ha

• Eom D‐h

  Hanyang Univ. Ansan Kor

• Eom Dae-hong

  Department Of Metallurgy And Materials Engineering Center For Electronic Materials And Components Ha

• Lee Eung-sug

  Precision Machining Group Korea Institute Of Machinery And Materials

• Eom Dae-Hong

  Department of Materials Engineering, Hanyang University, Ansan 426-791, Korea

• Park Jin-Goo

  Department of Bio-Nano Technology and Micro Biochip Center, Hanyang University, Ansan 426-791, Korea

関連論文

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• Effect of a guard-ring on the leakage current in a Si-PIN x-ray detector for a single photon counting sensor (Silicon devices and materials: 第15回先端半導体デバイスの基礎と応用に関するアジア・太平洋ワークショップ(AWAD2007))
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• Particle Removal and Its Mechanism on Hydrophobic Silicon Wafer in Highly Diluted NH_4OH Solutions with an Added Surfactant : Semiconductors
• Effect of Organic Acids in Copper Chemical Mechanical Planarization Slurry on Slurry Stability and Particle Contamination on Copper Surfaces
• Passivation and Etching of Wafer Surfaces in HF-H_2O_2-WA Solutions
• The Hydrophilization of Process Wafers in Dilute Hydrogen Peroxide Solutions and Ozonated Deionized Water and Its Effects on Defects and Gate Oxide Integrity
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