Development of Three Dimensional LIGA Process to Fabricate Spiral Microcoil
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概要
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The LIGA process has been developed as a 2.5-dimensional processing method on Si wafers to date. However, we have succeeded in extending the LIGA process to 3D for the first time. 3D-LIGA was achieved by the technical development of 3D X-ray lithography and worm injection molding replication technology with unscrewing. These technologies began from the development of equipment and have developed into quite original technologies. By combining this 3D-LIGA process with a metallization technique that consists of flat and smooth electroplating and isotropic chemical etching, a spiral copper microstructure with a linewidth of 10 μm, a pitch of 20 μm and a thickness of 2 μm was formed on a cylindrical surface made from LCP with a length of 1 mm and a diameter of 0.48 mm. Furthermore, we applied the process to fabricate a spiral microcoil and estimated the electrical properties of the microcoil. The numbers of turns were 15, the inductance was 91 nH and the quality factor was 5.8 for a frequency of 1 GHz. Direct-current resistance was measured as 99 $\Omega$.
- 2005-07-15
著者
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Shimizu Masami
Juken Kogyo Co. Ltd.
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YAMASHITA Michiru
Hyogo Prefectural Institute of Technology
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Mekaru Harutaka
Laboratory Of Advanced Science And Technology For Industry Himeji Institute Of Technology
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Kusumi Shinji
Susumu Co. Ltd.
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Shimada Osamu
Susumu Co. Ltd.
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Sato Noriaki
Juken Kogyo Co. Ltd.
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Hattori Tadashi
Laboratory Of Advanced Science And Technology For Industry
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Hattori Tadashi
Laboratory of Advanced Science and Technology for Industry, University of Hyogo, 3-1-2 Koto, Kamigori-cho, Ako-gun, Hyogo 678-1205, Japan
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Mekaru Harutaka
Laboratory of Advanced Science and Technology for Industry, University of Hyogo, 3-1-2 Koto, Kamigori-cho, Ako-gun, Hyogo 678-1205, Japan
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Shimizu Masami
Juken Kogyo Co., Ltd., 140-1 Kita-komukai, Komukai-cho, Toyohashi, Aichi 444-8003, Japan
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HATTORI Tadashi
Laboratory of Advanced Science & Technology for Industry, University of Hyogo
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