Superconductive Wire Bonding with High Reliability at 4.2 K
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概要
- 論文の詳細を見る
A superconductive bonding technique for superconducting electronic devices such as the DC-SQUID was developed by using a rapidly solidified Pb76In20Au4 (at%) wire. The wire was bonded on the Nb pad coated with 30 nm-thick Au film to form the superconducting connection operating at 4.2 K. Mechanical stability of the wire bond parts remains unchanged by 15 thermal cycles in the temperature range 4.2 to 273 K. No appreciable degradation of the superconducting connection is observed even after the thermal cycling. These results lead us to expect that the present bonding technique will be useful in practical applications.
- INSTITUTE OF PURE AND APPLIED PHYSICSの論文
- 1989-12-20
著者
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Masumoto Tsuyoshi
Institute For Materials Research
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Ogashiwa Toshinori
Tanaka Denshi Kogyo Ltd.
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Inoue Akihisa
Institiute For Materials Resarch Tohoku University
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Ogashiwa Toshinori
Tanaka Denshi Kogyo, Ltd., 8-5-1 Shimorenjaku, Mitaka, Tokyo 181
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