Ogashiwa Toshinori | Tanaka Denshi Kogyo Ltd.
スポンサーリンク
概要
関連著者
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Ogashiwa Toshinori
Tanaka Denshi Kogyo Ltd.
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OGASHIWA Toshinori
Tanaka Denshi Kogyo, Ltd.
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AKIMOTO Hideyuki
Tanaka Denshi Kogyo, Ltd.
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Shigyo Hiroyuki
Tanaka Denshi Kogyo Ltd.
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Akimoto Hideyuki
Tanaka Denshi Kogyo Ltd.
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NAKAGAWA Hiroshi
Electrotechical Laboratory (ETL)
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Takada Susumu
Electrotechnical Laboratory
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Nakagawa H
Assoc. Super‐advanced Electronics Technol. (aset) Yokohama Jpn
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Masumoto Tsuyoshi
Institute For Materials Research
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Inoue Akihisa
Institiute For Materials Resarch Tohoku University
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INOUE Akihisa
Institute for Materials Research, Tohoku University
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Mizuno Jun
Nanotechnology Research Laboratory, Waseda University
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Mizuno Jun
Nanotechnology Res. Lab. Waseda Univ.
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Inoue A
Institute For Materials Research Tohoku University
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Inoue Akihisa
Institute For Materials Research
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MASUMOTO Tsuyoshi
Institute for Materials Research, Tohoku University
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MURAKAMI Yoshihiro
Institute for Materials Research, Tohoku University
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SHIGYO Hiroyuki
Tanaka Denshi Kogyo, Ltd.
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Murakami Yoshihiro
Institute For Materials Research
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Ogashiwa Toshinori
Tanaka Denshi Kogyo, Ltd., 8-5-1 Shimorenjaku, Mitaka, Tokyo 181
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Nishimori Takashi
Tanaka Kikinzoku Kogyo K.K.
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Ikoma Tatsuya
SUSS MicroTec K.K.
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Ishida Hiroyuki
SUSS MicroTec K.K.
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Yazaki Takuya
SUSS MicroTec K.K.
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Kusamori Hiroyuki
Tanaka Kikinzoku Kogyo K.K.
著作論文
- Direct Solder Bump Formation Technique on Al Pad and Its High Reliability
- Flip-Chip Bonding Using Superconducting Solder Bump
- New Flip-Chip Bonding Technology for Supercondueting IC
- Low-Temperature Wafer Bonding for MEMS Hermetic Packaging Using Sub-micron Au Particles
- Superconductive Wire Bonding with High Reliability at 4.2 K