Akimoto Hideyuki | Tanaka Denshi Kogyo Ltd.

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概要

• 同名の論文著者
• Tanaka Denshi Kogyo Ltd.の論文著者

関連著者

• OGASHIWA Toshinori

  Tanaka Denshi Kogyo, Ltd.

• AKIMOTO Hideyuki

  Tanaka Denshi Kogyo, Ltd.

• Shigyo Hiroyuki

  Tanaka Denshi Kogyo Ltd.

• Ogashiwa Toshinori

  Tanaka Denshi Kogyo Ltd.

• Akimoto Hideyuki

  Tanaka Denshi Kogyo Ltd.

• NAKAGAWA Hiroshi

  Electrotechical Laboratory (ETL)

• Takada Susumu

  Electrotechnical Laboratory

• Nakagawa H

  Assoc. Super‐advanced Electronics Technol. (aset) Yokohama Jpn

• INOUE Akihisa

  Institute for Materials Research, Tohoku University

• Inoue A

  Institute For Materials Research Tohoku University

• Inoue Akihisa

  Institute For Materials Research

• MASUMOTO Tsuyoshi

  Institute for Materials Research, Tohoku University

• MURAKAMI Yoshihiro

  Institute for Materials Research, Tohoku University

• SHIGYO Hiroyuki

  Tanaka Denshi Kogyo, Ltd.

• Murakami Yoshihiro

  Institute For Materials Research

• Masumoto Tsuyoshi

  Institute For Materials Research

• Inoue Akihisa

  Institiute For Materials Resarch Tohoku University

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著作論文

• Direct Solder Bump Formation Technique on Al Pad and Its High Reliability
• Flip-Chip Bonding Using Superconducting Solder Bump
• New Flip-Chip Bonding Technology for Supercondueting IC

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