New Flip-Chip Bonding Technology for Supercondueting IC
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概要
- 論文の詳細を見る
A new flip-chip bonding method for achieving superconducting electrical contacts has been developed by employing a rapidly solidified Pb-2Sn-0.1Cu-0.5Sb (wt%) alloy wire. The solder balls were made from the wire by means of arc discharge in Ar gas containing H_2. The bumps were thermosonically fabricated on the Pb-20Sn film deposited on the mullite substrate. Subsequently, a Si chip coated with Nb/Au films was bonded on the substrate using those bumps by means of the thermal compression method. This method has a significant advantage of reducing the elevated temperature for flip-chip bonding to below 100℃.
- 社団法人応用物理学会の論文
- 1992-01-15
著者
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NAKAGAWA Hiroshi
Electrotechical Laboratory (ETL)
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Takada Susumu
Electrotechnical Laboratory
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OGASHIWA Toshinori
Tanaka Denshi Kogyo, Ltd.
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AKIMOTO Hideyuki
Tanaka Denshi Kogyo, Ltd.
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Shigyo Hiroyuki
Tanaka Denshi Kogyo Ltd.
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Nakagawa H
Assoc. Super‐advanced Electronics Technol. (aset) Yokohama Jpn
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Ogashiwa Toshinori
Tanaka Denshi Kogyo Ltd.
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Akimoto Hideyuki
Tanaka Denshi Kogyo Ltd.
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