M3-9 核沸騰熱伝達機構研究用MEMSセンサ(M3 熱流体デバイス)

概要

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The approach method to boiling heat transfer mechanism with MEMS (Micro-Electro-Mechanical systems) sensor has been developed. The MEMS sensor includes eight thin film thermocouples and trigger electrode on the top side of a silicon substrate and two thin film heaters on the back side. Thin film thermocouple was calibrated by a thermal scan method with two U-alloy samples. In the experiment, Temperature variation beneath the isolated bubble in continuous emission was measured with the sensor. Measured temperature data presents formation of microlayer and expansion of dry-out area in bubble growth process and rewetting in bubble departure process. Additionally, heat flow from the heated surface was evaluated by transient heat conduction analysis with the measurement data as a boundary condition.
一般社団法人日本機械学会の論文
2009-10-15