Mechanism of Resist Pattern Collapse during Development Process

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Electroplated Reflection Masks for Soft X-Ray Projection Lithography
Resist Performance in 5 nm Soft X-Ray Projection Lithography
Reduction Imaging at 4.5 nm with Schwarzschild Optics
Fabrication of 0.1μm Line-and-Space Patterns using Soft X-Ray Reduction Lithography
Sub-0.1 μm Resist Patterning in Soft X-Ray (13 nm) Projection Lithography
Antimony Aperture Properties on Super-Resolution Near-Field Structure using Different Protection Layers
The Near-Field Super-Resolution Properties of an Antimony Thin Film
Thermal Lithography for 100-nm Dimensions Using a Nano-Heat Spot of a Visible Laser Beam : Instrumentation, Measurement, and Fabrication Technology
Analysis of Deformation of X-Ray Mask Membrane in Aligner Motion
Prevention of Resist Pattern Collapse by Flood Exposure during Rinse Process
Freeze-Drying Process to Avoid Resist Pattern Collapse
Effect of Helium Gas Pressure on X-Ray Mask Heating during Synchrotron Radiation Exposure
High-Speed Optical Near-Field Photolithography by Super Resolution Near-Field Structure
Improvement of Super-RENS MO Disk Characteristics by Optimized Super-Resolution Near-Field Structure
Super-Resolution Readout Using a Silver Scattering Center with Plasmon Excitation Generated in a Non-Magnetic Readout Layer
Magneto-Optical Characteristics Enhanced by Super Resolution Near Field Structure
The Effects of Metal-Doped GeSbTe Films on Light Scattering-Mode Super-Resolution Near-Field Structure (Super-RENS)
Oxygen Doping Effects on Super-resolution Scattering-mode Near-field Optical Data Storage
A Near-Field Recording and Readout Technology Using a Metallic Probe in an Optical Disk
The Characteristics and the Potential of Super Resolution Near-Field Structure
Double Optical Phase Transition of GeSbTe Thin Films Sandwiched between Two SiN Layers
Electrical Properties of Nanometer-Width Refractory Metal Lines Fabricated by Focused Ion Beam and Oxide Resists
50-nm Metal Line Fabrication by Focused Ion Beam and Oxide Resists : Focused Ion Beam Process
50-nm Metal Line Fabrication by Focused Ion Beam and Oxide Resists
Mechanism of Resist Pattern Collapse during Development Process
Dual Function of Thin MoO_3 and WO_3 Films as Negative and Positive Resists for Focused Ion Beam Lithography
Down to 0.1 μm Pattern Replication in Synchrotron Radiation Lithography

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