Dependency of Adhesion Behavior on Thermtal Stress Distribution in Photoresist Micropatterns
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1993-02-15
著者
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Takata M
Nagaoka Univ. Technology Niigata
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TAKATA Masasuke
Department of Electrical Engineering, Nagaoka University of Technology
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KAWAI Akira
LSI Laboratory, Mitsubishi Electric Corporation
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Takata Masasuke
Department Of Electrical Engineering Nagaoka University Of Technology
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Nagata H
Sci. Univ. Tokyo Chiba‐ken Jpn
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NAGATA Hitosi
LSI Laboratory, Mitsubishi Electric Corporation
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Nagata Hitosi
Lsi Laboratory Mitsubishi Electric Corporation
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Takata M
Osaka Univ. Osaka Jpn
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Kawai Akira
Lsi Laboratory Mitsubishi Electric Corporation
関連論文
- Shrinkage Effect of Local Area of Polymer Film on Adhesion Behavior
- Blister Formation at Photoresist-Substrate Interface
- Local Peeling of Photoresist Film during Ultraviolet Light Exposure
- Adhesion of Photoresist Pattern Baked at 80 to 325℃ to Inorganic Solid Surface
- Adhesion of Photoresist Pattern Baked at 80 to 325℃ in Tetramethyl-ammonium-hydroxide Aqueous Solution
- Characterization of Surface Energetic Behavior by Atomic Force Microscopy
- Adhesion of Photoresist Micropattern to Aluminum Substrate in Alkaline Aqueous Solution
- Dependence of Offset Error on Overlay Mark Structures in Overlay Measurement
- Adhesion between Photoresist and Inorganic Substrate : Resist Material and Process
- Adhesion between Photoresist and Inorganic Substrate