Monolithic Integration of Resonant Tunneling Diodes, Schottky Barrier Diodes and 0.1-$\mu$m-gate High Electron Mobility Transistors for High-Speed ICs

概要

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Monolithic integration technology for resonant tunneling diodes (RTDs), Schottky barrier diodes (SBDs), and 0.1-$\mu$m-gate high electron mobility transistors (HEMTs) was developed. The integration process was investigated to overcome the difficulty in fabricating both RTDs with a mesa height of 530 nm and HEMTs with a gate length of 0.1 $\mu$m. The HEMT and SBD structures were grown by metalorganic chemical vapor deposition (MOCVD) on a 2-inch InP substrate. The RTD structure was regrown by molecular beam epitaxy (MBE) on the top layer grown by MOCVD@. The characteristics of the fabricated devices showed good uniformity. An analog-to-digital converter and a selector circuit fabricated with these devices operated properly. The presented integration technology is a promising way to provide novel circuits with RTDs, SBDs and 0.1-$\mu$m-gate HEMTs.
Publication Office, Japanese Journal of Applied Physics, Faculty of Science, University of Tokyoの論文
2001-04-15