HfO2/HfAlO/HfO2 Nanolaminate Charge Trapping Layers for High-Performance Nonvolatile Memory Device Applications
スポンサーリンク
概要
- 論文の詳細を見る
A high-$\kappa$ HfO2/HfAlO/HfO2 nanolaminate charge trapping layer in a p-Si/SiO2/[HfO2/HfAlO/HfO2 nanolaminate]/Al2O3/platinum memory capacitor has been investigated. High-$\kappa$ HfO2, Al2O3, and HfO2/HfAlO/HfO2 nanolaminate charge trapping layers are deposited by atomic layer deposition. Well-behaved counter clockwise capacitance–voltage hysteresis characteristics are observed for all memory capacitors. A large memory window of ${\sim}10$ V, a very low leakage current density of ${\sim}5\times 10^{-9}$ A/cm2 at a gate voltage of $-5$ V, a high charge trapping density of ${\sim}1.6\times 10^{13}$/cm2, and a low charge loss of ${\sim}20$% after 10 years of retention for the HfO2/HfAlO/HfO2 nanolaminate charge trapping layer are observed as compared with those of pure HfO2 and pure Al2O3 charge trapping layers. Excellent memory characteristics of HfO2/HfAlO/HfO2 nanolaminate layers are obtained owing to the layer-by-layer charge storage. High-$\kappa$ HfO2/HfAlO/HfO2 nanolaminate charge trapping layers can be used in future nanoscaled high-performance nonvolatile memory device applications.
- 2007-04-15
著者
-
Lee Heng-yuan
Electronics And Optoelectronics Research Laboratories Industrial Technology Research Institute
-
Tsai Ming-jinn
Electronics And Optoelectronics Research Laboratories (eol)
-
TZENG Pei-Jer
Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
-
WANG Ting-Yu
Department of Material Science Engineering, National Taiwan University
-
LEE Lurng-Shehng
Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
-
Yang Jer-ren
Department Of Material Science Engineering National Taiwan University
-
Lin Cha-hsin
Electronics And Optoelectronics Research Laboratories Industrial Technology Research Institute
-
Maikap Siddheswar
Department And Graduate Institute Of Electrical Engineering College Of Engineering Chang Gung Univer
-
Wang Ching-Chiun
Electronics and Opto-Electronics Research Laboratories, Industrial Technology Research Institute (EOL/ITRI), Hsinchu 310, Taiwan
-
Wang Ting-Yu
Department of Material Science Engineering, National Taiwan University, Taipei, Taiwan 310, R.O.C.
-
Lee Heng-Yuan
Electronics and Opto-Electronics Research Laboratories, Industrial Technology Research Institute (EOL/ITRI), Hsinchu 310, Taiwan
-
Tzeng Pei-Jer
Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan 310, R.O.C.
-
Tzeng Pei-Jer
Electronics and Opto-Electronics Research Laboratories, Industrial Technology Research Institute (EOL/ITRI), Hsinchu 310, Taiwan
-
Tsai Ming-Jinn
Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan 310, R.O.C.
-
Wang Ching-Chiun
Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan 310, R.O.C.
-
Yang Jer-Ren
Department of Material Science Engineering, National Taiwan University, Taipei, Taiwan 310, R.O.C.
-
Maikap Siddheswar
Department of Electronic Engineering, Chang Gung University, Tao-Yuan, Taiwan 333, R.O.C.
-
Lee Heng-Yuan
Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan 310, R.O.C.
-
Lin Cha-Hsin
Electronics and Opto-Electronics Research Laboratories, Industrial Technology Research Institute (EOL/ITRI), Hsinchu 310, Taiwan
-
Lin Cha-Hsin
Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan 310, R.O.C.
-
Tsai Ming-Jinn
Electronic and Opto-Electronic Research Laboratories, Industrial Technology Research Institute, Hsinchu 310, Taiwan
-
Lee Lurng-Shehng
Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan 310, R.O.C.
-
Lee Lurng-Shehng
Electronics and Opto-Electronics Research Laboratories, Industrial Technology Research Institute (EOL/ITRI), Hsinchu 310, Taiwan
関連論文
- A novel method to convert metallic-type CNTs to semiconducting-type CNT-FETs
- Influence of High Indium Composition InGaN on Lattice Matched ZnO Sacrificial Substrates
- HfO_2/HfAlO/HfO_2 Nanolaminate Charge Trapping Layers for High-Performance Nonvolatile Memory Device Applications
- Low-power switching of nonvolatile resistive memory using hafnium oxide (Special issue: Solid state devices and materials)
- Low Power Operation of Non-volatile Hafnium Oxide Resistive Memory
- Comprehensive HSPICE Model of Phase Change Memory Cell for Static and Transient Programming
- Characteristics Improvement of Phase Change Memory with Programming Pulse Width
- Improved Bipolar Resistive Switching of HfOx/TiN Stack with a Reactive Metal Layer and Post Metal Annealing
- Particle Size and Morphology of Iridium Oxide Nanocrystals in Non-Volatile Memory Device
- Physical and Memory Characteristics of Atomic-Layer-Deposited High-$\kappa$ Hafnium–Aluminum-Oxide Nanocrystal Capacitors with Iridium-Oxide Metal Gate
- HfO2/HfAlO/HfO2 Nanolaminate Charge Trapping Layers for High-Performance Nonvolatile Memory Device Applications
- A Comprehensive Parameterized Model of Phase-Change Memory Cell for HSPICE Circuit Simulation
- Nanoscale Multigate TiN Metal Nanocrystal Memory Using High-$k$ Blocking Dielectric and High-Work-Function Gate Electrode Integrated on Silcon-on-Insulator Substrate
- Formation-Polarity-Dependent Improved Resistive Switching Memory Performance Using IrOx/GdOx/WOx/W Structure
- Record Resistance Ratio and Bipolar/Unipolar Resistive Switching Characteristics of Memory Device Using Germanium Oxide Solid Electrolyte
- Using Spike-Anneal to Reduce Interfacial Layer Thickness and Leakage Current in Metal–Oxide–Semiconductor Devices with TaN/Atomic Layer Deposition-Grown HfAlO/Chemical Oxide/Si Structure
- TiO2 Nanocrystal Prepared by Atomic-Layer-Deposition System for Non-Volatile Memory Application
- Low-Power Switching of Nonvolatile Resistive Memory Using Hafnium Oxide