Thermal stability of electroless nickel-molybdenum-phosphorus alloy films.
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概要
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The structure and the electric resistivity of electroless Ni–Mo–P alloy films, which were plated from a caustic alkali citrate-glycolic acid bath, have been investigated. The phosphorus content in deposits and the deposition rate decreased with increasing Mo-complex concentration which was formed with sodium gluconate before constructing the bath. The crystallized structure and the formation of solid solutions between the Ni matrix and the codeposited Mo were indicated by X-ray diffraction measurments for high Mo-complex concentration range. On the other hand, amorphous states appeared for the Mo-complex concentration range lower than 0.002 mol dm<SUP>−3</SUP>. In the range less than 0.002 mol dm<SUP>−3</SUP> Mo-complex concentration, the resistivity of as-plated Ni–Mo–P films was higher than the binary Ni–P alloy film plated from the bath without the Mo-complex. In the higher Mo-complex concentration range, the resistivity immediately reached a constant value independently of the Mo-complex concentration. After 500 and 800 °C heat treatment under vacuum, the resistivity increased with increasing Mo-complex concentration. Moreover for the higher Mo-complex concentration range, the resistivity after heat treatment became higher than that of as-plated conditions, and the increased resistivity after the heat treatment depended on the Mo content in the deposits. Therefore, the codeposited Mo tended to increase the thermal stability of the films.
- 公益社団法人 日本化学会の論文
著者
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Koiwa Ichiro
Department Of Applied Chemistry Science And Engineering Waseda University
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Osaka Tetsuya
Department Of Applied Chemistry Faculty Of Science And Engineering Waseda University
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Yamada Keizo
Department of Applied Chemistry, School of Science and Engineering, Waseda University
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Nishikawa Masao
Department of Applied Chemistry, School of Science and Engineering, Waseda University
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