Effects of Ni-P substrate structure and Pd/Au film thicknesses on the wire bonding strength of electroless Au/Pd/Ni-P films (特集 TCEP2007英文論文集)
スポンサーリンク
概要
- 論文の詳細を見る
The local corrosion of nickel can occur during the gold plating in Au/Ni fabrication processes. The wire bonding strength decreases as the nickel is diffused to the gold surface by the heat treatment. Accordingly, palladium plating is generally applied as an interlayer between the nickel plating and the gold plating to avoid the local corrosion of nickel. However the influence of the nickel layer structure and the noble metal film thickness on the wire bonding strength has not been investigated in detail. In this study, we investigated how the structure of the deposited nickel and the thickness of the noblemetal film influenced the wire bonding properties. The bonding strength of nickel was higher with a layered structure than with a columnar structure when the gold and palladium films were 0.05μm thick.
- 社団法人エレクトロニクス実装学会の論文
- 2008-01-01
著者
-
Watanabe Hideto
Chemicals Division Kojima Chemicals Co. Ltd.
-
Saito Yuichi
Graduate School of Engineering, Kanto Gakuin University
-
Terashima Hajime
Graduate School of Engineering, Kanto Gakuin University
-
Muramatsu Takeshi
Chemicals Division, Kojima Chemicals Co., Ltd.
-
Koiwa Ichiro
Department of Applied Material and Life Science, Faculty of Engineering, Kanto Gakuin University
-
Honma Hideo
Department of Applied Material and Life Science, Faculty of Engineering, Kanto Gakuin University
-
Honma Hideo
Department Of Applied Material And Life Science Faculty Of Engineering Kanto Gakuin University
-
Honma Hideo
Kanto Gakuin University Surface Engineering Research Institute Co. Ltd.
-
Koiwa Ichiro
Department Of Applied Chemistry Science And Engineering Waseda University
-
Koiwa Ichiro
Kanto Gakuin University Surface Engineering Research Institute Co. Ltd.
-
Terashima Hajime
Graduate School Of Engineering Kanto Gakuin University
-
Muramatsu Takeshi
Chemicals Division Kojima Chemicals Co. Ltd.
-
Saito Yuichi
Graduate School Of Engineering Kanto Gakuin University:kanto Gakuin University Surface Engineering R
-
Saito Yuichi
Graduate School Of Engineering Kanto Gakuin University
関連論文
- Effects of Ni-P substrate structure and Pd/Au film thicknesses on the wire bonding strength of electroless Au/Pd/Ni-P films (特集 TCEP2007英文論文集)
- Multi-Chip Module Fabricated by W-CSP Method using Excimer Laser Via-Hole Formation and Cu Plating
- Effect of Annealing Method to Crystalize on Sr_Bi_Ta_2O_ Thin Film Properties Formed from Alkoxide Solution
- Orientation Control of Sr_Bi_Ta_2O_ Thin Films by Chemical Liquid Deposition
- Crystallization of Sr_Bi_Ta_O_ Thin Films by Chemical Liquid Deposition
- Orientation Control of Sr_Bi_Ta_2O_9 Thin Films by Chemical Process
- Electroless Nickel Plating under Continuous Ultrasonic Irradiation to Fabricate a Near-Field Probe Whose Metal Coat Decreases in Thickness toward the Tip
- Effect of Phosphorus Content of the Magnetic and Electric Properties of Electroless Ni-P Film after Heat Treatment : Magnetism, Magnetic Materials and Devices
- Control of Crystal Orientation of Ferroelectric SrBi_2Ta_2O_9 Thin Films with Multi-Seeding Layers
- Effects of H_2 Sintering and Pt Upper Electrode on Metallic Bi Content in Sr_Bi_Ta_2O_9 Thin Films for Ferroelectric Memories Prepared by Sol-Gel Method
- Crystallization Process of Sr_Bi_Ta_2O_9 Thin Films with Different Crystal Orientation Prepared by Chemical Liquid Deposition Using Alkoxide Precursor(Special Issue on Advanced Memory Devices Using High-ε and Ferroelectric Films)
- Structural Defects in Sr_Bi_Ta_2O_9 Thin Film for Ferroelectric Memory(Special Issue on Advanced Memory Devices Using High-ε and Ferroelectric Films)
- Phase Transition in Ferroelectric SrBi_2Ta_2O_9) Thin Films with Change of Heat-treatment Temperature
- Correlation between Magnetic Properties and Composition of Electroless-Plated Cobalt Alloy Films for Perpendicular Magnetic Recording Media
- Role of Excess Bi in SrBi_2Ta_2O_9 Thin Film Prepared Using Chemical Liquid Deposition and Sol-Gel Method
- Pretreatment of Nickel Plating on ASA Resin Using Ozonated Water as Replacement for Chromic Acid Etching
- Low Voltage Operation of Ferroelectric Sr_Bi_Ta_2O_9 Thin Films Crystallized by Excimer Laser Annealing
- Reduction of Process-induced Damage and Improvement of Imprint Characteristics in SrBi2Ta2O9 Capacitors by Postmetallization Annealing
- Preparation of Ferroelectric Sr_Bi_Ta_2O_9 Thin Films by Misted Deposition Method Using Alkoxide Solution(Special Issue on Advanced Memory Devices Using High-ε and Ferroelectric Films)
- A Study on MgO Powder and MgO Liquid Binder in the Screen-Printed Protective Layer for AC-PDPs
- Effects of Storage Conditions on Imprint Characteristics in SrBi2Ta2O9 Capacitors
- 電気銅めっきによるULSI配線形成における各種添加剤の影響
- Complete magnetic anisotropy films for perpendicular recording prepared by an electroless plating method.
- Thermal stability of electroless nickel-molybdenum-phosphorus alloy films.
- Effect of molybdenum codeposition on the thermal properties of electroless Ni-B alloy plating films.