成形回路部品の透過レーザ光による回路描画

概要

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A preliminary study on laser structuring of thin metal film on shadowed surface of molded interconnect devices (MID) was carried out. For this purpose, a structuring method that removes metal film that is deposited on transparent plastic by laser irradiation shooting the film not directly but through the plastic is proposed. Several tests using copper film of 0.3μm in thickness deposited on cycloolefine copolymer (COC) plates and THG-YAG laser were performed. With respect to preciseness of structuring, the new method was not inferior to normal direct shooting. Though estimated temperature rise by absorption of the laser by the plastic is such a small value of 0.74K due to high transparency of the plastic, it was damaged along the laser flight path. The damage can be categorized into three groups. One occurs on the whole flight path. This type of damage reduces as laser power is decreased, and an intensity that eliminates the damage without sacrificing quality of structuring was found. Another occurs in places on the path. This is also reduced as the laser power is decreased, but we did not find a laser power that can prevent this damage and provides correct structuring at the same time. The other one was found on the plastic surface from which the thin film has been removed. However, this type of damage is even milder than the case of conventional laser structuring.
公益社団法人精密工学会の論文