Aluminum Reflow Behavior in Via-Hole Filling Investigated by Molecular Dynamics Simulation and Computer Graphics

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概要

• 論文の詳細を見る
• 社団法人応用物理学会の論文
• 1995-12-30

著者

• Kumagai M

  National Research Institute For Metals

• Miyamoto A

  New Ind. Creation Hatchery Center Tohoku Univ.

• Endou Akira

  Department of Applied Chemistry, Graduate School of Engineering, Tohoku University

• MIYAMOTO Akira

  Department of Applied Chemistry, Graduate School of Engineering, Tohoku University

• Kubo Momoji

  Department Of Molecular Chemistry And Engineering Tohoku University

• Kubo Momoji

  Department Of Applied Chemistry Graduate School Of Engineering Tohoku University

• Endou Akira

  Dep. Of Applied Chemistry Graduate School Of Engineering Tohoku Univ.

• Yamauchi R

  Gifu Univ. Gifu Jpn

• Yamauchi Ryo

  Department Of Molecular Chemistry And Engineering Faculty Of Engineering Tohoku University

• Yamauchi Ryo

  The United Graduate School Of Agricultural Science Gifu University

• Kawasaki Masashi

  Department Of Applied Biological Science Tokyo Noko University

• Yamauchi Ryo

  Department Of Applied Life Science Faculty Of Applied Biological Sciences Gifu University

• KATAGIRI Masahiko

  Department of Molecular Chemistry & Engineering, Faculty of Engineering, Tohoku University

• STIRLING Aandras

  Department of Molecular Chemistry and Engineering, Faculty of Engineering, Tohoku University

• OHTA Tomohiro

  Tel Engineering Ltd.

• Miyamoto Akira

  Department Of Applied Chemistry Graduate School Of Engineering Tohoku University

• Endou Akira

  Department Of Applied Chemistry Graduate School Of Engineering Tohoku University

• Stirling Aandras

  Department Of Molecular Chemistry And Engineering Faculty Of Engineering Tohoku University

• YAMAUCHI Ryo

  Department of Agricultural Chemistry, Gifu University

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