狭ピッチリードフレームはんだ接合部の破断モードと合金層成長 : LSIパッケージ用リードフレーム材料の接続に関する研究(第2報)

概要

論文の詳細を見る
In high temperature aging test (150℃ in Air), the peel strength is weakened by intermetalic compound growth of copper and tin. This report focused on the analysis of soldered layer to understand the reasons of reduced peel strength after thermal exposure. Even if 42 alloy (Fe-42 mass%Ni), under-plated copper layer (electric copper plating) causes the Cu-Sn intermetalic growth and break from η layer (C6Sn5). And in case of the copper lead, Cu-Sn intermetalic layer is very thick. Because of that, copper lead bulk thickness is reduced and causing the lead bulk break befor intermetalic break. These break modes are changing through the again time, from solder bulk, lead bulk and finaly to intermetalic compound layer breaking.
社団法人溶接学会の論文
1997-02-05